Flexible Printed Circuit (FPC) is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film. It has the characteristics of high wiring density, light weight, thin thickness and good bending performance.

Single/double sided release film is mainly used for laminating adhesive products due to its excellent high-temperature resistance characteristics. The product uses PET as the substrate and is evenly coated with an extremely thin release agent on one or both sides. The release film surface is flat and smooth, and the coating is uniform, without defects such as wrinkles, particles, bubbles, etc.

In the process of producing release films, we will encounter various problems. Today, the editor of Shenzhen release film manufacturers will share with you the common problems encountered during the production process of release films.

There are many specialized terms in PCB circuit boards, and it is also necessary to know these terms. Here, we will explain some professional terms in PCB circuit boards.

The main salt refers to the salt in the plating solution that can deposit the required coating metal on the cathode, used to provide metal ions. The concentration of main salt in the plating solution must be within an appropriate range. Increasing or decreasing the concentration of main salt, while other conditions remain unchanged, will have an impact on the electrodeposition process and the final coating structure.

Shenzhen Ruichangxing Technology Co., Ltd. lists some of the most commonly encountered PCB laminate problems and how to confirm them here. Once encountering PCB laminate issues, it should be considered to add them to the PCB laminate material specification.

The Mitsui TPX release film can be used as a high-performance release film for various purposes, leveraging its excellent release and heat resistance,

Bubbling on the surface of a circuit board is actually a problem of poor adhesion between the board and the surface, which can be further extended to include two aspects:

Firstly, there is an understanding of the definitions of the two. Release force, also known as release degree, refers to the degree of release of release paper. There is no absolute value at this point, and it depends on the formula of each manufacturer. Depending on the amount of oil applied, it can be divided into light, medium, and heavy release forces. The peel strength refers to whether the release paper (film) is easy to peel off from the attached product, which is determined through strict testing.

Test steps: Place the TESA7475 adhesive surface downwards and lightly press the adhesive strip onto the clean test board. Use a pressure roller to press back and forth at a speed of approximately 10mm/second twice, making the adhesive surface in close contact with the test board. (The release film needs to be pulled or fixed on the test board.) After the test strip is applied properly, it should be left for 20 minutes before testing. If permanent peeling force needs to be tested, it needs to be left for 24 hours. Debug the stripping angle to 180 °, set the speed to 300mm/min, and run the test on startup.

High temperature resistant release film: it is made of polyimide film as the base material, coated with imported high temperature resistant silicone pressure sensitive adhesive, and then coated with polyester release film. Tape has excellent high temperature resistance, electrical insulation, and chemical resistance; And it is non-toxic, odorless, and harmless to the human body and environment, due to its extremely low release force.

The circuit board pressure transmission and pressing cushion pad is developed and produced for the ultra-high temperature press currently used in the PCB industry. When the circuit board pressing temperature exceeds 260 ℃, the general Kraft paper, cushion pad and other auxiliary materials can no longer meet the pressing demand of high temperature, and fiber materials with higher temperature resistance must be used. At present, this RCX-K25 cushion has excellent temperature resistance and can meet the requirements of ultra-high temperature pressing.